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Jiangsu GIS Laser Technologies Inc.,
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24um 380V Three Phase PCB LDI Laser Direct Imaging ISO 9001 CE LD Laser

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24um 380V Three Phase PCB LDI Laser Direct Imaging ISO 9001 CE LD Laser

Brand Name : GIS

Model Number : DPX230

Certification : ISO 9001 CE

Place of Origin : Jiangsu, China

MOQ : 1 set

Price : negotiable price

Supply Ability : 30set per month

Delivery Time : 20 work days

Packaging Details : wooden case packing

Name : laser Direct Imaging (LDI)

Application : PCB HDI FPC

Exposure Size Max : 610*710mm

Line Width : 30μ

Line Line Distance : 10%

Line Width tolerance : 10%

Alignment Capability : 24μm

Laser Type : LD Laser, 405±5nm

Efficient : 30-40S@18"*24"

Deviation increase and decrease : Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment

File Format : Gerber 274X, ODB++

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laser direct imaging (LDI) system solutions for various PCB Multilayer

LDI is carried out with a laser beam that is scanned across UV photoresist surface and switched on and off by means of a computer control system according to the copper circuit pattern. It has been proved that LDI systems, which work in UV spectrum are most suitable for obtaining fine lines and spaces below 0.075mm (3mil).


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model DPX230
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 30um
Capacity 30-40S@18"*24"
Exposure Size 610*710mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.


Product Tags:

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24um 380V Three Phase PCB LDI Laser Direct Imaging ISO 9001 CE LD Laser Images

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