laser direct imaging (LDI) system solutions for various PCB Multilayer
LIMATA Laser Direct Imaging Solutions
Increased technical requirements in PCB manufacturing driven by more advanced PCB designs (towards thinner materials, more complex and finer structures at only small design rule tolerances) have set limitations for the conventional mask contact lithography (phototool) method in particular for the production of more advanced PCB applications.
This has led to a shift in production technology from conventional mask contact lithography to the Maskless Direct Imaging of PCBs, where a software controlled laser or light-source is used to image a pattern directly on a photoresist coated panel or to image liquid solder mask/resist layers at the backend of the PCB manufacturing process.
Key advantages of the Direct Imaging (DI) technology include:
·Higher accuracy in registration as well as printing (line uniformity)
·Higher depth-of-focus
·Full product and process traceability during the manufacturing process (data interfaces)
·Higher productivity and quality levels (throughput and yields) during PCB production
·Lower process costs and total costs of ownership versus conventional mask/film lithography during the pattern or solder mask process
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
| Specification/model |
DPX230 |
| Application |
PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) |
30um |
| Capacity |
30-40S@18"*24" |
| Exposure Size |
610*710mm |
| Panel thickness |
0.05mm-3.5mm |
| Alignment Mode |
UV-Mark |
| Alignment capability |
Outer layer±12um；Inner laye±24um |
| Line width tolerance |
±10% |
| Deviation increase and decrease mode |
Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type |
LD Laser,405±5nm |
| File format |
Gerber 274X；ODB++ |
| Power |
380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition |
Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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380V Three Phase LDI Laser Direct Imaging Equipment 30um Images
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